Micromodule (printed circuit board) assembler

Office only · Ukraine (Kyiv) · 1.5 years of experience

Requirements:


secondary specialized education, higher (unfinished higher);

skills and abilities in assembling SMD and DIP components;

understanding of the principles of operation of electronic components and their assembly on printed circuit boards;

understanding of quality requirements and standards related to the assembly of printed circuit boards;

experience working with soldering equipment, tools for assembly and testing printed circuit boards;

ability to read and understand printed circuit board assembly diagrams;

skills in tracing boards

Responsibilities:


control the quality of soldering;

repair of printed circuit boards;

assembly of SMD and DIP components

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